Annular Ring and Feature Clearances | ||
 | Outer layer | Value min (mm) |
| A | 0.10 | |
| B | 0.20 | |
| C | 0.15 | |
| Inner layer | Value min (mm) | |
| A | 0.10 | |
| B | 0.20 | |
| C | 0.15 | |
Track to Feature Clearances | ||||
 | ||||
| Outer Layer (mm) | ||||
| 18 µm Cu foil: (TOTAL THICKNESS) | 0.075 | 0.075 | 0.10 | 0.15 |
| 35 µm Cu foil: (TOTAL THICKNESS) | 0.1 | 0.1 | 0.125 | 0.2 |
| 70 µm Cu foil: (TOTAL THICKNESS) | 0.125 | 0.125 | 0.165 | 0.23 |
| 105 µm Cu foil: (TOTAL THICKNESS) | 0.165 | 0.165 | 0.2 | 0.25 |
| 140 µm Cu foil: (TOTAL THICKNESS) | 0.2 | 0.2 | 0.225 | 0.27 |
| 175 µm Cu foil: (TOTAL THICKNESS) | 0.235 | 0.235 | 0.255 | 0.28 |
| 210 µm Cu foil: (TOTAL THICKNESS) | 0.265 | 0.265 | 0.285 | 0.3 |
| Inner Layer (mm) | ||||
| 18 µm Cu foil: | 0.075 | 0.075 | 0.1 | 0.2 |
| 35 µm Cu foil: | 0.075 | 0.075 | 0.1 | 0.22 |
| 70 µm Cu foil: | 0.125 | 0.125 | 0.15 | 0.24 |
| 105 µm Cu foil: | 0.175 | 0.175 | 0.20 | 0.25 |
| 140 µm Cu foil: | 0.2 | 0.2 | 0.225 | 0.26 |
| 175 µm Cu foil: | 0.225 | 0.225 | 0.25 | 0.27 |
| 210 µm Cu foil: | 0.25 | 0.25 | 0.3 | 0.29 |
Solder Resist and Legend | |||
| Solder Resist | Standard colour: | Green | |
| Other colours: | Yellow, Black, orange, red, blue, purple | ||
| Nominal Thickness: | 4 | µm | |
| Min Thickness: | 4-35 | µm | |
| According to IPC-SM-840 class H | yes | Yes/No | |
| Legend print | Minimum line width of legend | 0.1 | µm |
| Standard colour: | white | ||
| Other colours: | yellow | ||
Solder resist features to ensure no encroachment | ||||
 | Feature type | Value min | (mm) | |
| SMT to covered copper | A | 0.125 | ||
| SMT to SMT with kept bridge | B | 0.175 | ||
| Soldermask oversize | C | 0.05 | ||
| Soldermask bridge | D | 0.075 | ||
Remak: The date is base on the TOTAL Cu THICKNESS which is below 70um | ||||
Peelable Mask & Kapton tape | |||
| Peelable Mask | Nominal Thickness: | ≥0.3 | (mm) |
| Minimum Thickness: | 0.3 | (mm) | |
| Max covered hole diameter: | 3.5 | (mm) | |
| Min distance to not covered feature: | 0.4 | (mm) | |
| Kapton tape (to cover larger holes) | Can Use | Y | Y/N |
| Nominal Thickness: | 0.065+/-0.002 | (mm) | |
Drilling/ Routing / V-cut | |||||
| Drilling | Min. hole mechanically drilled | 0.2 | mm | ||
| Max. hole mechanically drilled | 6.50 | mm | |||
| Standard | Best | ||||
| Hole tolerances (finished hole) | PTH holes < 5mm | 0.075 | +/-mm | 0.05 | +/-mm |
| PTH holes > 5mm | 0.075 | +/-mm | 0.075 | +/-mm | |
| NPTH holes < 5mm | 0.05 | +/-mm | 0.05 | +/-mm | |
| NPTH holes > 5mm | 0.075 | +/-mm | 0.075 | +/-mm | |
| PTH Slots | 0.075 | +/-mm | 0.075 | +/-mm | |
| NPTH Slots | 0.05 | +/-mm | 0.05 | +/-mm | |
| Drill registration | PTH / NPTH against pattern (first drill) | 0.125 | +/-mm | ||
| NPTH against pattern (secondary drill) | 0.125 | +/-mm | |||
| Aspect Ratio | 12:1 | X:X | |||
| Profiling | Rout Diameters (mm) | Standard: | 1.5,1.6 | ||
| Others: | 0.8,1.0,1.2, 2.0 | ||||
| Standard | Best | ||||
| Rout edge to copper | 0.3 | +/-mm | 0.3 | +/-mm | |
| Rout Tolerance | 0.125 | +/-mm | 0.1 | +/-mm | |
| Control depth routing tolerance | 0.2 | +/-mm | 0.2 | +/-mm | |
Scoring / V-cut | |||||
 | Feature type | Nom. (mm) | Min (mm) | ||
| Distance to copper | A | 0.7 | 0.4 board thickness: 1.0 mm) | ||
| Thickness of remaining core | B | 0.4 | 0.2 | ||
| Position accuracy | C | 0.125 | 0.1 | ||
| Depth | D | \ | \ | ||
| Scoring / V-cut | Min board thickness: | 0.4 | mm | ||
| Max board thickness: | 3.2 | mm | |||
Build-up / Multilayer | |||
| Core | Min thickness used | 0.075 without copper | mm |
| Type of prepreg used | FR4 | ||
| Board thickness | Tolerance board > 1mm | 10 | +/- % |
| Tolerance board< 1mm | 0.1 | +/-mm | |
| Capability | Max thickness ML board: | 4.5 | mm |
| Min thickness 4 Layer: | 0.35 | mm | |
| Min thickness 6 Layer | 0.50 | mm | |
| Min thickness 8 Layer | 0.65 | mm | |
| Min thickness 10 Layer | 0.85 | mm | |
| Min thickness 12 Layer | 1.0 | mm | |
Standard build-up used for 1.6 mm thick board with 35 µm copper finished on all layers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Via hole plugging techniques | |||
| Plugging techniques | Soldermask | Y | Y/N |
| Resin non conductive | Y | Y/N | |
| Resin electrical conductive | N | Y/N | |
| Resin thermal conductive | N | Y/N | |
| Overplated plugs (IPC 4761 type VII) | Y | Y/N | |
| Max hole size | Soldermask plug | 0.5 | mm |
| Resin non conductive | 0.6 | mm | |
| Resin electrical conductive | \ | mm | |
| Resin thermal conductive | \ | mm | |
| HDI capability (Fill in only if applicable)\ | |||
| Laser drilled hole | Min. hole size | 0.1 | mm |
| Max. hole size | 0.25 | mm | |
| Aspect Ratio | Normal | 0.7:1 | X:X |
| Best | 0.75:1 | X:X | |
| Build-up material used | RCC | Y | Y/N |
| RCC High Tg | Y | Y/N | |
| LD Prepreg | Y | Y/N | |
| LD Prepreg High Tg | N | N | |
| Aramid | N | N | |
| Polyimide | N | N | |
| No-Flow prepreg | N | N | |
| Speedboard C | N | N | |
| Others | N | N | |
| Technique | 1+N+1 | N | N |
| 2+N+2 (staggered µvia) | N | N | |
| 3+N+3 (staggered µvia) | N | N | |
| 4+N+4 (staggered µvia) | N | Y/N | |
| 2+N+2 (stacked µvia) | N | N | |
| 3+N+3 (stacked µvia) | N | N | |
| 4+N+4 (stacked µvia) | N | N | |
| 1-2-3 (step down µvia | N | N | |
| Filling technique µvia | Copper filled | N | N |
| Resin filled (overplated) | N | N | |
| Copper pillar | N | N | |
Design features HDI | |||
 | Preferred | Min. | |
| Entry pad (A) | 300 µm | µm | |
| Target pad L1 (A) | 300 µm | µm | |
| Hole L1-L2 (B) | 125 µm | µm | |
 | Preferred | Min. | |
| Entry pad (A) | N/A µm | µm | |
| Target pad L2 (A) | N/A µm | µm | |
| Target pad L3 (A) | N/A µm | µm | |
| Hole L1-L2 (B) | N/A µm | µm | |
| Hole L2-L3 (B) | N/A µm | µm | |
 | Preferred | Min. | |
| Entry pad (A) | 400 µm | µm | |
| Target pad L2 (A) | 400 µm | µm | |
| Target pad L3 (D) | 300 µm | µm | |
| Hole L1-L2 (B) | 200 µm | µm | |
| Hole L2-L3 (C) | 125 µm | µm | |
 | Preferred | Min. | |
| Entry pad (A) | 300 µm | µm | |
| Target pad L1 (C) | 500 µm | µm | |
| µvia hole L1-L2 (B) | 125µm | µm | |
| Buried hole (D) | 250 µm | µm | |